The Mobile
Broadband Standard

3GPP TDocs (written contributions) at meeting

Meeting: R3-95 - 2017-02-13 to 2017-02-17, Athens

meeting id: R3-95 (click id for more info on this meeting)

Click on the Tdoc to open its file.

TDoc Title Source Remarks
R3‑170345 RAN3#95 Meeting Agenda MCC imported from 3GU
R3‑170346 RAN3#94 Meeting Report MCC imported from 3GU
R3‑170347 3GPPRAN3-NR Adhoc #1 meeting report MCC imported from 3GU
R3‑170348 Reply LS to the progress of QoE Measurement Collection for Streaming to RAN3, SA4, SA5 and CT1 3GPP CT WG1, Huawei imported from 3GU
R3‑170349 LS on progress of CT1 work on LTE light connection 3GPP CT WG1, Qualcomm imported from 3GU
R3‑170350 Reply LS on QoS for Priority Services 3GPP SA WG2, Applied Communication Sciences (AppComSci) imported from 3GU
R3‑170351 LS on Inter-UE QoS support for CP CIoT UEs 3GPP SA WG2, Huawei imported from 3GU
R3‑170352 Reply LS on mobility enhancements for eNB-IoT 3GPP SA WG2, Huawei imported from 3GU
R3‑170353 Response to LS on SA2 involvement for the light connection 3GPP SA WG2, Ericsson imported from 3GU
R3‑170354 Reply LS on the progress of QoE Measurement Collection for Streaming 3GPP SA WG5, Huawei imported from 3GU
R3‑170355 Authorization for Pedestrian UE over S1 LG Electronics Inc., Huawei, CATT, ZTE imported from 3GU
R3‑170356 Inter-eNB mobility with LWA active Nokia, Alcatel-Lucent Shanghai Bell, Intel Corporation imported from 3GU
R3‑170357 Introduction of WLAN band indication Intel Corporation (UK) Ltd imported from 3GU
R3‑170358 Introduction of New types of eNB ID Huawei, China Telecom imported from 3GU
R3‑170359 Introduction of New types of eNB ID Huawei, China Telecom imported from 3GU
R3‑170360 Introduction of New types of eNB ID Huawei, China Telecom imported from 3GU
R3‑170361 Introduction of New types of eNB ID Huawei, China Telecom imported from 3GU
R3‑170362 Introduction of UE PC5 AMBR over S1 CATT, ZTE, Huiawei imported from 3GU
R3‑170363 Introduction of UE-PC5-AMBR Huawei, CATT imported from 3GU
R3‑170364 Correction of handling of GBR bearer in the MME Nokia, Alcatel-Lucent Shanghai Bell, Huawei imported from 3GU
R3‑170365 Support of Redirection for VoLTE Huawei imported from 3GU
R3‑170366 PLMN ID Check and Enhanced TV Services Ericsson imported from 3GU
R3‑170367 Introduction of New types of eNB ID Huawei, China Telecom imported from 3GU
R3‑170368 Clarification that the Xw UE ID is unique within relevant node Nokia, Alcatel-Lucent Shanghai Bell, Intel Corporation imported from 3GU
R3‑170369 X2AP Support for Inter-eNB Mobility without WT Change Ericsson, Nokia, Alcatel-Lucent Shanghai Bell, Intel Corporation, Brocade, Qualcomm Incorporated imported from 3GU
R3‑170370 XwAP Support for Inter-eNB Mobility without WT Change Ericsson, Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170371 Uplink bearer identification Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation imported from 3GU
R3‑170372 Enabling uplink data bearers Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation imported from 3GU
R3‑170373 Enabling uplink data bearers Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation imported from 3GU
R3‑170374 Enabling uplink data bearers Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation imported from 3GU
R3‑170375 Authorization for Pedestrian UE over X2 LG Electronics Inc., Huawei, CATT, ZTE imported from 3GU
R3‑170376 Introduction of new period values for MBMS LG Electronics Inc. imported from 3GU
R3‑170377 Introduction of MBMS deployment for V2X LG Electronics Inc., CATT, Huawei imported from 3GU
R3‑170378 WT Notifying neighbour eNB information on Xw NEC imported from 3GU
R3‑170379 Consideration on RAN function split between CU and DU CATT imported from 3GU
R3‑170380 TP on RAN function split between CU and DU CATT imported from 3GU
R3‑170381 Further Clarification of CU-DU Split Option 3-1 CATT imported from 3GU
R3‑170382 Consideration on the protocol stack and functions of CU/DU interface CATT imported from 3GU
R3‑170383 TP on the protocol stack and functions of CU/DU interface CATT imported from 3GU
R3‑170384 Consideration on impacts to intra-gNB mobility in case of CU/DU split CATT imported from 3GU
R3‑170385 TP on impacts to intra-gNB mobility in case of CU/DU split CATT imported from 3GU
R3‑170386 Consideration on SeNB change procedure CATT imported from 3GU
R3‑170387 TP on SeNB change procedure CATT imported from 3GU
R3‑170388 TR 36.742 v0.3.1 on Study on SON for eCoMP Nokia imported from 3GU
R3‑170389 TR 36.742 v0.3.1 on Study on SON for eCoMP Nokia imported from 3GU
R3‑170390 TR 36.742 v0.3.1 on Study on SON for eCoMP Nokia imported from 3GU
R3‑170391 Reply LS to the progress of QoE Measurement Collection for Streaming to RAN3, SA4, SA5 and CT1 3GPP CT WG1, Huawei imported from 3GU
R3‑170392 LS on progress of CT1 work on LTE light connection 3GPP CT WG1, Qualcomm imported from 3GU
R3‑170393 Reply LS on QoS for Priority Services 3GPP SA WG2, AppComSci imported from 3GU
R3‑170394 LS on Inter-UE QoS support for CP CIoT UEs 3GPP SA WG2, Huawei imported from 3GU
R3‑170395 Reply LS on mobility enhancements for eNB-IoT 3GPP SA WG2, Huawei imported from 3GU
R3‑170396 Response to LS on SA2 involvement for the light connection 3GPP SA WG2, Ericsson imported from 3GU
R3‑170397 Reply LS on SA2 involvement for the light connection 3GPP SA WG3-LI, BT imported from 3GU
R3‑170398 LS on LI requirements reconfirmed, including 5G and CIoT 3GPP SA WG3-LI, Minvenj imported from 3GU
R3‑170399 Reply LS to the progress of QoE Measurement Collection for Streaming 3GPP SA WG4, Ericsson imported from 3GU
R3‑170400 Reply LS on the progress of QoE Measurement Collection for Streaming 3GPP SA WG4, Huawei imported from 3GU
R3‑170401 Reply LS on RAN-Assisted Codec Adaptation 3GPP SA WG4, Intel imported from 3GU
R3‑170402 Liaison on new project on Transport for 5G Mobile Networks MEF imported from 3GU
R3‑170403 Introduction of new period values for MBMS LG Electronics Inc. imported from 3GU
R3‑170404 Open Issue on UE-PC5-AMBR LG Electronics Inc. imported from 3GU
R3‑170405 Transmission of RRC message via CU-DU interface LG Electronics Inc. imported from 3GU
R3‑170406 TP on transmission of RRC message via the CU-DU interface LG Electronics Inc. imported from 3GU
R3‑170407 Procedures aspects for Option 4/4a and Option 7/7a LG Electronics Inc. imported from 3GU
R3‑170408 TP for Option 4 and 7 on procedures LG Electronics Inc. imported from 3GU
R3‑170409 Technical issues to resolve in both solutions Nokia, Alcatel-Lucent Shanghai Bell, Broadcom, Telekom R&D Sdn. Bhd., AT&T imported from 3GU
R3‑170410 Discussion on the arguments against Xw Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170411 Supporting LWIP with XwAP - New Procedure Descriptions Nokia, Ericsson LM, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170412 Enabling LWIP support over Xw Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170413 Enabling LWIP support over Xw Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170414 Cleanup of the support for high reliability Interdigital Asia LLC imported from 3GU
R3‑170415 Clean up for functional split Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170416 TP of Clean up for functional split Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170417 Specification of high layer split options Nokia, Alcatel-Lucent Shanghai Bell, Huawei, HiSilicon, Ericsson, CATT, ZTE, Fujitsu imported from 3GU
R3‑170418 TP of Specification of high layer split options Nokia, Alcatel-Lucent Shanghai Bell, Huawei, HiSilicon, Ericsson, CATT, ZTE, Fujitsu imported from 3GU
R3‑170419 Conclusion on higher layer split option Nokia, Alcatel-Lucent Shanghai Bell, AT&T imported from 3GU
R3‑170420 TP of Conclusion on higher layer split option Nokia, Alcatel-Lucent Shanghai Bell, AT&T imported from 3GU
R3‑170421 QoS aspects for SCG spilt bearer Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170422 TP of QoS aspects for SCG spilt bearer Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170423 TNL address discovery for Xx interface establishment Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170424 TP of TNL address discovery for Xx interface establishment Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170425 Offline discussion on CP mobility Huawei imported from 3GU
R3‑170426 A new cause for S1 NAS recovery in NB-IoT Huawei imported from 3GU
R3‑170427 Introduction of a new cause for S1 NAS recovery in NB-IoT Huawei imported from 3GU
R3‑170428 [DRAFT] Reply LS on mobility enhancements for eNB-IoT Huawei imported from 3GU
R3‑170429 Discussion on the OTDOA enhancements for eNB-IOT Huawei imported from 3GU
R3‑170430 Introduction of OTDOA enhancements for NB-IOT Huawei imported from 3GU
R3‑170431 Discussion on support of UTDOA for eNB-IOT Huawei imported from 3GU
R3‑170432 Introduction of UTDOA enhancements for NB-IOT (CR LPPa) Huawei imported from 3GU
R3‑170433 Introduction of UTDOA enhancements for NB-IOT(CR SLmAP) Huawei imported from 3GU
R3‑170434 Coverage level for location service Huawei imported from 3GU
R3‑170435 Introduction of coverage level for location service Huawei imported from 3GU
R3‑170436 RAN3 impacts on Inter-UE QoS support Huawei imported from 3GU
R3‑170437 Introduction of S1 UE information retrieve procedure Huawei imported from 3GU
R3‑170438 Introduction of S1 UE information retrieve procedure Huawei imported from 3GU
R3‑170439 Coverage enhancement authorization Huawei, Intel imported from 3GU
R3‑170440 Introduction of Coverage Enhancement Authorization Huawei, Intel imported from 3GU
R3‑170441 Introduction of light connection in X2AP Huawei, Nokia, China Telecom, China Unicom, Qualcomm Incorporated, Samsung imported from 3GU
R3‑170442 Introduction of light connection in S1AP Huawei, Nokia, China Telecom, China Unicom, Samsung, Intel, Qualcomm Incorporated imported from 3GU
R3‑170443 Discussion on RAN Paging Area Huawei imported from 3GU
R3‑170444 Open issues for RAN initiated Paging Huawei imported from 3GU
R3‑170445 eNB handling in case of RAN paging failure Huawei imported from 3GU
R3‑170446 CN Paging Assistance Huawei imported from 3GU
R3‑170447 CP signalling handling in Light connection Huawei imported from 3GU
R3‑170448 Impact on legacy functions for Light Connection Huawei imported from 3GU
R3‑170449 MME awareness of Light Connection Huawei imported from 3GU
R3‑170450 Correction on eMTC Paging support Huawei imported from 3GU
R3‑170451 Indication on UE monitoring IMSI mode 16384 for Paging Huawei imported from 3GU
R3‑170452 Indication on UE monitoring IMSI mode 16384 for Paging Huawei imported from 3GU
R3‑170453 Authorization in FeD2D wearable Huawei imported from 3GU
R3‑170454 Path selection in FeD2D wearable Huawei imported from 3GU
R3‑170455 Baseline TP to TR36.746 Huawei imported from 3GU
R3‑170456 Clarification to UE-PC5-AMBR CATT imported from 3GU
R3‑170457 S1CR Clarification to UE-PC5-AMBR CATT imported from 3GU
R3‑170458 X2CR Clarification to UE-PC5-AMBR CATT imported from 3GU
R3‑170459 Introduction of UE-PC5-AMBR for V2X CATT imported from 3GU
R3‑170460 Exchange V2X configuration between eNBs CATT imported from 3GU
R3‑170461 Exchange V2X Configuration between eNBs CATT imported from 3GU
R3‑170462 Exchange V2X Configuration between eNBs CATT imported from 3GU
R3‑170463 LS out on exchange V2X Config Info between eNBs CATT imported from 3GU
R3‑170464 Discussion on X2 related issues for LC CATT imported from 3GU
R3‑170465 X2 is not available CATT imported from 3GU
R3‑170466 RAN Paging failure CATT imported from 3GU
R3‑170467 TP for Paging procedure of NG interface Huawei imported from 3GU
R3‑170468 Paging procedure of NG interface Huawei imported from 3GU
R3‑170469 New RAN functions Huawei imported from 3GU
R3‑170470 TP for New RAN functions Huawei imported from 3GU
R3‑170471 Evaluation and Conclusion for SCG split bearer LG Electronics Inc. imported from 3GU
R3‑170472 TP on Evaluation and Conclusion for SCG split bearer LG Electronics Inc. imported from 3GU
R3‑170473 Updates for solution 1 and 2 Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170474 Additional use case and solutions required to complete the study item Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170475 Evaluation criteria proposal Nokia, Alcatel-Lucent Shanghai Bell, Fujitsu imported from 3GU
R3‑170476 Solution evaluation Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170477 Why do we need to optimize coordination areas? Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170478 Choice of option for data forwarding and specification impact Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170479 Enable simultaneous radio transmission and data forwarding for Make-Before-Break handover Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170480 Enable simultaneous radio transmission and data forwarding for Make-Before-Break handover Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170481 Activation of make-before-break handover Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170482 Activation of make-before-break HO Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170483 High layer functional split and control-user planes separation Vodafone Group Services Ltd imported from 3GU
R3‑170484 TS 36.414 Support for transport level packet marking Applied Communication Sciences, OEC, AT&T imported from 3GU
R3‑170485 TS 36.424 support for transport level packet marking Applied Communication Sciences, OEC, AT&T imported from 3GU
R3‑170486 Limitation Concerning DSCP Assignments for MPS and Way Forward Applied Communication Sciences, OEC, AT&T imported from 3GU
R3‑170487 Proposed way forward on lower layer functional split between CU-DU for NR Deutsche Telekom, Telecom Italia, NTT DoCoMo, Orange, AT&T, Verizon, SK Telecom, KT, China Unicom imported from 3GU
R3‑170488 Proposed way forward on higher layer functional split between CU-DU for NR Deutsche Telekom, Telecom Italia, NTT DoCoMo, Orange, AT&T, Verizon, SK Telecom, KT, China Unicom, Vodafone imported from 3GU
R3‑170489 Introduction of SCG split bearer as Option 7X for NG Core Deutsche Telekom, Nokia, Alcatel-Lucent Shanghai Bell, Huawei imported from 3GU
R3‑170490 Conclusion of QoS in New RAN LG Electronics Inc. imported from 3GU
R3‑170491 TP on conclusion of QoS in New RAN LG Electronics Inc. imported from 3GU
R3‑170492 Evaluation and Conclusion for Intra-system mobility procedures LG Electronics Inc. imported from 3GU
R3‑170493 TP on Evaluation and Conclusion for Intra-system mobility procedures LG Electronics Inc. imported from 3GU
R3‑170494 Discussion on PDU Session Management for NG interface CATT imported from 3GU
R3‑170495 Update QoS Principles for QoS flow to DRB mapping CATT imported from 3GU
R3‑170496 TP for update QoS Principles for QoS flow to DRB mapping CATT imported from 3GU
R3‑170497 TP on PDU Session Management for NG interface CATT imported from 3GU
R3‑170498 Reply LS on Flexible eNB-ID and Cell-ID in E-UTRAN China Telecommunications imported from 3GU
R3‑170499 Introduction on new SID of inter-eNB LTE Carrier Aggregation with Non-ideal Backhaul China Telecommunications,China Unicom,ZTE,CITC imported from 3GU
R3‑170500 CU-DU interface principles and functions IAESI, Thales, Fairspectrum, VTT imported from 3GU
R3‑170501 TP for CU-DU interface principles and functions IAESI, Thales, Fairspectrum, VTT imported from 3GU
R3‑170502 eLWIP: Xs user plane protocol Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170503 eLWIP: Xs data transport Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170504 Way forward on interface selection for eLWIP Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170505 Solution selection for RAN paging failure Intel Corporation imported from 3GU
R3‑170506 Remaining open issues of light connection Intel Corporation imported from 3GU
R3‑170507 Slicing solution down-selection Intel Corporation, Ericsson, ZTE Corporation, LG Electronics Inc. imported from 3GU
R3‑170508 Slicing solution down-selection (pCR) Intel Corporation, Ericsson, ZTE Corporation, LG Electronics Inc. imported from 3GU
R3‑170509 Conclusions of the information collection and feedback discussion Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170510 TP on description correction for path switch procedure Samsung imported from 3GU
R3‑170511 TP on paging procedure description Samsung imported from 3GU
R3‑170512 PDU session related progress Samsung imported from 3GU
R3‑170513 TP on procedure description for session related procedures Samsung imported from 3GU
R3‑170514 DC procedure for tight interworking option 4 and option 7 Samsung imported from 3GU
R3‑170515 TP for tight interworking option 4 and option 7 Samsung imported from 3GU
R3‑170516 TP on removal of the unrelated note for PDU session Samsung imported from 3GU
R3‑170517 Discussion on LC issues in SA2 LS Samsung imported from 3GU
R3‑170518 Issues in SA2 LS requiring RAN3 decision Samsung imported from 3GU
R3‑170519 Discussion on X2 absent Samsung imported from 3GU
R3‑170520 Further Discussion and Updates for eLTE ZTE Corporation imported from 3GU
R3‑170521 TP for Capturing eLTE Relevant Agreements ZTE Corporation imported from 3GU
R3‑170522 Correction on mobility in network slicing Samsung R&D Institute UK imported from 3GU
R3‑170523 Correction on mobility in network slicing Samsung R&D Institute UK imported from 3GU
R3‑170524 Text Proposal for mobility in network slicing Samsung R&D Institute UK imported from 3GU
R3‑170525 Procedure for Tight interworking option 4 and option 7 Samsung R&D Institute UK imported from 3GU
R3‑170526 Text Proposal for Tight interworking option 4 and option 7 Samsung R&D Institute UK imported from 3GU
R3‑170527 Text Proposal for Xn interface Samsung R&D Institute UK imported from 3GU
R3‑170528 Further Clean-ups for TR 38.801 ZTE Corporation imported from 3GU
R3‑170529 TP for TR 38.801 Clean-ups ZTE Corporation imported from 3GU
R3‑170530 TP for Xn Interface Relevant Corrections ZTE Corporation imported from 3GU
R3‑170531 TP for NG Interface Relevant Corrections ZTE Corporation imported from 3GU
R3‑170532 Further Consideration on Xn Procedures for NR/LTE Tight-Interworking ZTE Corporation imported from 3GU
R3‑170533 Further Consideration on Xn Procedures for NR/NR Tight-Interworking ZTE Corporation imported from 3GU
R3‑170534 TP for New Section of Intra-NR Dual Connectivity ZTE Corporation imported from 3GU
R3‑170535 TP for UP Protocol Stack Updates with LTE-NR Tight-Interworking Option 4/4a/7/7a ZTE Corporation imported from 3GU
R3‑170536 UE Capability Coordination over XnAP and X2AP Due to NR-LTE Tight Interworking ZTE Corporation imported from 3GU
R3‑170537 TP for UE Capability Coordination over XnAP and X2AP ZTE Corporation imported from 3GU
R3‑170538 NW Slicing Mobility in Inter-System Scenario ZTE Corporation imported from 3GU
R3‑170539 TP for NW Slicing Mobility in Inter-System Scenario ZTE Corporation imported from 3GU
R3‑170540 Report of Unofficial Email Discussions on LTE_eMob Leftover Issues ZTE Corporation imported from 3GU
R3‑170541 Introduction of eMOB Stage2 of RAN3 Part ZTE Corporation, Samsung, China Telecom, China Unicom imported from 3GU
R3‑170542 Introduction of eMOB Stage3 ZTE Corporation, Samsung, China Telecom, China Unicom imported from 3GU
R3‑170543 Corrections to CN/RAN functional split Huawei imported from 3GU
R3‑170544 TP: Corrections to CN/RAN functional split Huawei imported from 3GU
R3‑170545 Support for eLTE slicing Huawei imported from 3GU
R3‑170546 TP: Support for eLTE slicing Huawei imported from 3GU
R3‑170547 Corrections for slicing Huawei imported from 3GU
R3‑170548 TP: Corrections for slicing Huawei imported from 3GU
R3‑170549 Corrections for QoS Huawei imported from 3GU
R3‑170550 TP: Corrections for QoS Huawei imported from 3GU
R3‑170551 Updates of solution 2 Huawei, Ericsson imported from 3GU
R3‑170552 Mobility procedure considering network slice LG Electronics Inc. imported from 3GU
R3‑170553 Text proposal on mobility procedure considering network slice LG Electronics Inc. imported from 3GU
R3‑170554 UE context management between eNBs without X2 interface LG Electronics Inc. imported from 3GU
R3‑170555 Open issue for RAN-initiated paging failure LG Electronics Inc. imported from 3GU
R3‑170556 TR 30.531 v1.27.0 Work Plan and Working Procedures - RAN WG3 ETSI MCC imported from 3GU
R3‑170557 Discussion on the solution of TCP optimization Huawei imported from 3GU
R3‑170558 TP for the solutions of TCP optimization Huawei imported from 3GU
R3‑170559 Discussion on the solution of video optimization Huawei imported from 3GU
R3‑170560 TP for the solution of video optimization Huawei imported from 3GU
R3‑170561 TP for the evaluation of solutions for case 2 Huawei imported from 3GU
R3‑170562 Further discussion on QoS impact on mobility ZTE Corporation imported from 3GU
R3‑170563 Discussion on solutions to address backhaul long latency issue Nokia, Alcatel-Lucent Shanghai Bell, CMCC, Qualcomm Incorporated, NEC, ZTE imported from 3GU
R3‑170564 Text Proposal for solutions to address backhaul long latency issue Nokia, Alcatel-Lucent Shanghai Bell, CMCC, Qualcomm Incorporated, NEC, ZTE imported from 3GU
R3‑170565 Evaluation on the solutions for DASH optimization (Issue 3 – case 2) Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170566 Text Proposal for Evaluation on the solutions for DASH optimization (Issue 3 – case 2) Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170567 Discussion on solutions for TCP optimization Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170568 Text Proposal for solutions to address issue 2 Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170569 Overload control for CP CIoT EPS optimization NEC, Qualcomm Incorporated imported from 3GU
R3‑170570 Overload control for CP CIoT EPS optimization NEC, Qualcomm Incorporated imported from 3GU
R3‑170571 More consideration on option 3-1 NEC imported from 3GU
R3‑170572 TP on more considerations on option 3-1 NEC imported from 3GU
R3‑170573 Possible ways for standardizing function split NEC imported from 3GU
R3‑170574 TP on Possible ways for standardizing function split NEC imported from 3GU
R3‑170575 RAN paging failure: How to Seek CN Assistance Gracefully? NEC imported from 3GU
R3‑170576 Solution for RAN paging failure: Use of UE Context Release NEC imported from 3GU
R3‑170577 Stage 2: Solution for RAN paging failure: Use of UE Context Release NEC imported from 3GU
R3‑170578 Stage 3: Solution for RAN paging failure: Use of UE Context Release NEC imported from 3GU
R3‑170579 INACTIVE STATE and Xn Removal NEC imported from 3GU
R3‑170580 pCR:INACTIVE STATE and Xn Removal NEC imported from 3GU
R3‑170581 TP for QOS impact on mobility procedure ZTE Corporation imported from 3GU
R3‑170582 Discussion on default QOS ZTE Corporation imported from 3GU
R3‑170583 TP on default QOS ZTE Corporation imported from 3GU
R3‑170584 Discussion on scenario of inter-system intra-RAT handover ZTE Corporation imported from 3GU
R3‑170585 TP on scenario of inter-system intra-RAT handover ZTE Corporation imported from 3GU
R3‑170586 Consideration on RRC message transmission ZTE Corporation imported from 3GU
R3‑170587 TP for RRC message transmission ZTE Corporation imported from 3GU
R3‑170588 TP for QoS clean-ups ZTE Corporation imported from 3GU
R3‑170589 Higher-Layer Split Option Altiostar Networks imported from 3GU
R3‑170590 Specification of Lower-Layer Split Architecture Altiostar Networks imported from 3GU
R3‑170591 Consideration of RAN Function Support in CU-DU Split Architecture Altiostar Networks imported from 3GU
R3‑170592 On CU-DU Interface Specification Altiostar Networks imported from 3GU
R3‑170593 CU-DU interface ZTE Corporation imported from 3GU
R3‑170594 TP for CU-DU interface ZTE Corporation imported from 3GU
R3‑170595 Discussion on the higher layer CU/DU function splits ZTE Corporation imported from 3GU
R3‑170596 TP for the higher layer CU/DU function splits ZTE Corporation imported from 3GU
R3‑170597 URLLC Requirement Cleanup ZTE Corporation imported from 3GU
R3‑170598 TP for URLLC Requirement Cleanup ZTE Corporation imported from 3GU
R3‑170599 Discussion on the Open Issues of LC ZTE Corporation imported from 3GU
R3‑170600 The CP solution for NB IOT mobility enhancement ZTE Corporation imported from 3GU
R3‑170601 TP for Xn interface procedure descriptions ZTE Corporation imported from 3GU
R3‑170602 Initial Considerations on Rel14 feD2D ZTE Corporation imported from 3GU
R3‑170603 Considerations for inter-system mobility KT Corp. imported from 3GU
R3‑170604 Analysis of HL Split Options in the specification point of view and conclusion for way-forward Samsung R&D Institute UK imported from 3GU
R3‑170605 Additional Xn procedure and descriptions LG Electronics Inc. imported from 3GU
R3‑170606 TP for additional Xn procedure and descriptions LG Electronics Inc. imported from 3GU
R3‑170607 RAN3 impacts of QMC for streaming services Huawei imported from 3GU
R3‑170608 Introduction of QMC for streaming services Huawei imported from 3GU
R3‑170609 Introduction of QMC for streaming services Huawei imported from 3GU
R3‑170610 Introduction of QMC for streaming services Huawei imported from 3GU
R3‑170611 Introduction of QMC for streaming services Huawei imported from 3GU
R3‑170612 LWIP Addition and Modification Ericsson, Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170613 Introduction of the light connected mode Ericsson imported from 3GU
R3‑170614 Introduction of the light connected mode Ericsson imported from 3GU
R3‑170615 Introduction of eDECOR in RAN Ericsson imported from 3GU
R3‑170616 Introduction of eDECOR in RAN Ericsson imported from 3GU
R3‑170617 Introduction of eDECOR in RAN Ericsson, NEC imported from 3GU
R3‑170618 CU-DU interface: Overall categorization of C-plane and U-plane NTT DOCOMO INC. imported from 3GU
R3‑170619 CU-DU interface: C&M-plane aspects NTT DOCOMO INC. imported from 3GU
R3‑170620 CU-DU interface: U-plane aspects NTT DOCOMO INC. imported from 3GU
R3‑170621 FFS on CP between EPC and gNB NTT DOCOMO INC. imported from 3GU
R3‑170622 FFS and editor’s note on TR38.801 NTT DOCOMO INC. imported from 3GU
R3‑170623 RRC diversity for LTE-NR tight interworking Huawei imported from 3GU
R3‑170624 TP on RRC diversity for LTE-NR tight interworking Huawei imported from 3GU
R3‑170625 Considerations on SCG split bearer Huawei, Deutsche Telekom, Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170626 TP for SCG split bearer as Option 7x Huawei, Deutsche Telekom, Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170627 Corrections on Option 3/3a/3x LG Electronics Inc. imported from 3GU
R3‑170628 eLWIP: Xs stage-2 proposal for TS 36.300 Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170629 eLWIP: Xs Application Protocol Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170630 Introducing UE throughput indication Intel Corporation, Qualcomm Incorporated imported from 3GU
R3‑170631 IMSI-paging based Restoration and eDRX Nokia, Alcatel-Lucent Shanghai Bell, NEC, Qualcomm Incorporated imported from 3GU
R3‑170632 IMSI-paging based Restoration and eDRX Nokia, Alcatel-Lucent Shanghai Bell, NEC, Qualcomm Incorporated imported from 3GU
R3‑170633 IMSI-paging based Restoration and eDRX Nokia, Alcatel-Lucent Shanghai Bell, NEC, Qualcomm Incorporated imported from 3GU
R3‑170634 Introduction of eDECOR Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170635 Introduction of eDECOR Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170636 Introduction of eDECOR Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170637 Introduction of eDECOR Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170638 Introduction of eDECOR Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170639 CN node selection Qualcomm Incorporated imported from 3GU
R3‑170640 TP on CN Node Selection Qualcomm Incorporated imported from 3GU
R3‑170641 TP for network slice and CN node selection Qualcomm Incorporated imported from 3GU
R3‑170642 Paging procedures Qualcomm Incorporated imported from 3GU
R3‑170643 Paging procedures Qualcomm Incorporated imported from 3GU
R3‑170644 Further details on gNB architecture Qualcomm Incorporated imported from 3GU
R3‑170645 TP on further details on gNB architecture Qualcomm Incorporated imported from 3GU
R3‑170646 Fs Interface principles Qualcomm Incorporated imported from 3GU
R3‑170647 TP on Fs Interface principles Qualcomm Incorporated imported from 3GU
R3‑170648 UE capability handling in RAN Qualcomm Incorporated imported from 3GU
R3‑170649 TP on UE capability handling in RAN Qualcomm Incorporated imported from 3GU
R3‑170650 Update of QOS signalling aspects Qualcomm Incorporated imported from 3GU
R3‑170651 TP on update of QOS signalling aspects Qualcomm Incorporated imported from 3GU
R3‑170652 TP for clean-up of section 10.1.2 Qualcomm Incorporated imported from 3GU
R3‑170653 CN Impact Analysis Qualcomm Incorporated imported from 3GU
R3‑170654 On mobility without WT change Qualcomm Incorporated imported from 3GU
R3‑170655 On mobility in CP-CIoT Qualcomm Incorporated imported from 3GU
R3‑170656 Handling of NB-IOT UE capabilities Qualcomm Incorporated, Huawei imported from 3GU
R3‑170657 Handling of NB-IOT UE capabilities Qualcomm Incorporated, Huawei imported from 3GU
R3‑170658 Introduction of Light Connected State Nokia, Alcatel-Lucent Shanghai Bell, Huawei, China Telecom, China Unicom imported from 3GU
R3‑170659 X2 Paging priority and Policy Enforcement in Light connection Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170660 RAN Paging Failure and CN Paging Assistance Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170661 Mode Selection when moving out of the RAN Paging Area Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170662 Overview of Legacy impacts of light connection feature Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170663 Reachability and periodical Paging Area Update Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170664 Access Agnostic Design Principles Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170665 Access Agnostic Design principle Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170666 Slice-dedicated SCTP streams Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170667 Information transfer between eNB, WT and UE for LWIP Ericsson imported from 3GU
R3‑170668 Correction of M3 configuration in MDT Ericsson, Sprint imported from 3GU
R3‑170669 Correction of MDT M3 Configuration Ericsson, Sprint imported from 3GU
R3‑170670 Correction of MDT M3 Configuration Ericsson, Sprint imported from 3GU
R3‑170671 On SCTP for NR Ericsson imported from 3GU
R3‑170672 Paging Ericsson imported from 3GU
R3‑170673 Further considerations on Multicast Paging Ericsson imported from 3GU
R3‑170674 TP on Further Considerations for Multicast Paging Ericsson imported from 3GU
R3‑170675 Clarifications on the use of NSSAI in Network Slicing Ericsson imported from 3GU
R3‑170676 TP on Clarifications on the use of NSSAI in Network Slicing Ericsson imported from 3GU
R3‑170677 Mobility and Mapping of NW slices Ericsson imported from 3GU
R3‑170678 TP on Mobility and Mapping of NW slices Ericsson imported from 3GU
R3‑170679 Further Mobility Procedures descriptions for NW slicing Ericsson imported from 3GU
R3‑170680 TP on Further Mobility Procedures descriptions for NW slicing Ericsson imported from 3GU
R3‑170681 The cons of standardizing low-layer splits Ericsson, Huawei, HiSilicon imported from 3GU
R3‑170682 TP on the cons of standardizing low-layer splits Ericsson, Huawei, HiSilicon imported from 3GU
R3‑170683 Network deployments based on option 2 Ericsson imported from 3GU
R3‑170684 TP on Network deployment based on option 2 Ericsson imported from 3GU
R3‑170685 Performance evaluation of option 3 Ericsson imported from 3GU
R3‑170686 Way forward on standardization of RAN split architectures Ericsson, Huawei, HiSilicon imported from 3GU
R3‑170687 Use of AMBR for PC5 Ericsson imported from 3GU
R3‑170688 Discussion on the reply LS on Flexible eNB-ID and Cell-ID in E-UTRAN from SA5 Ericsson imported from 3GU
R3‑170689 Reply to the reply LS on Flexible eNB-ID and Cell-ID in E-UTRAN Ericsson imported from 3GU
R3‑170690 On the CR versions for LC provided to RAN3#95 Ericsson imported from 3GU
R3‑170691 Introduction of the light connected mode Ericsson imported from 3GU
R3‑170692 On Open Issues identified in SA2 and way forward proposal Ericsson imported from 3GU
R3‑170693 [DRAFT] Response to LS on SA2 involvement for the light connection Ericsson imported from 3GU
R3‑170694 Discussion on QoE Measurement Collection for Streaming in RAN Ericsson imported from 3GU
R3‑170695 Mobility Solution for Rel-14 CP NB-IoT Enhancements Ericsson imported from 3GU
R3‑170696 Support of RLF with UE Context Retrieval for CP CIoT Optimisation Ericsson imported from 3GU
R3‑170697 Support of RLF with UE Context Retrieval for CP CIoT Optimisation Ericsson imported from 3GU
R3‑170698 Support of RLF with UE Context Retrieval for CP CIoT Optimisation Ericsson imported from 3GU
R3‑170699 Reliable DL NAS delivery based on hop-by-hop acknowledgements Ericsson imported from 3GU
R3‑170700 Reliable DL NAS delivery based on hop-by-hop acknowledgements Ericsson imported from 3GU
R3‑170701 SC-PTM for IoT Ericsson imported from 3GU
R3‑170702 Stage 2 Description of SC-PTM for IoT Ericsson imported from 3GU
R3‑170703 Further discussion on eDECOR in RAN Ericsson imported from 3GU
R3‑170704 Introduction of eDECOR in RAN Ericsson imported from 3GU
R3‑170705 Discussion and conclusions on CASD Issues Ericsson imported from 3GU
R3‑170706 TP on discussion and conclusions on CASD Issues Ericsson imported from 3GU
R3‑170707 Discussion and conclusions on long backhaul delays Issue Ericsson imported from 3GU
R3‑170708 TP on conclusions for long backhaul delays issue Ericsson imported from 3GU
R3‑170709 Slice-dedicated SCTP streams Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170710 Correction of slicing principles Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170711 Correction of slicing principles Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170712 Correction of slicing and connected mobility Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170713 Correction of slicing and connected mobility Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170714 Correction of QoS principles Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170715 Correction of QoS principles Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170716 Correction of NG-based Handover Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170717 Correction of NG-based Handover Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170718 Inter-RAT mobility use-cases Fujitsu imported from 3GU
R3‑170719 Forwarding for CP signaling in light connection LG Electronics Inc. imported from 3GU
R3‑170720 TP for Conclusion on Selection of Network Slice and CN Entity by new RAN Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170721 Proposed Way Forward on functional split Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170722 TP of Proposed Way Forward on functional split Nokia, Alcatel-Lucent Shanghai Bell imported from 3GU
R3‑170723 Clarification on UE slice connectivity CMCC imported from 3GU
R3‑170724 Support of SCG split bearer as Option 7x for non-standalone NR CMCC imported from 3GU
R3‑170725 TP for support of SCG split bearer as Option 7x for non-standalone NR CMCC imported from 3GU
R3‑170726 Way forward on functional split between CU-DU for NR CMCC imported from 3GU
R3‑170727 Editorial update of Draft TR 36.933 CMCC imported from 3GU
R3‑170728 TP for Update and Evaluation of solution for issue 1 CMCC, Qualcomm Incorporated imported from 3GU
R3‑170729 TP for evaluation and conclusion of solutions for issue 3 CMCC imported from 3GU
R3‑170730 TP on RAN internal function split in TR38.801 Huawei imported from 3GU
R3‑170731 Discussion on RAN internal function split in TR38.801 Huawei imported from 3GU
R3‑170732 TP for including PDAP layer Huawei imported from 3GU
R3‑170733 Reconsideration of higher layer split options Huawei, CMCC imported from 3GU
R3‑170734 Introduction of forwarding for CP signaling in light connection LG Electronics Inc. imported from 3GU
R3‑170735 TP for Reconsideration of higher layer split options Huawei, CMCC imported from 3GU
R3‑170736 Issues in standardization of lower layer splits 5, 6, 7 Huawei , HiSilicon, Ericsson, Nokia, Alcatel-Lucent Shanghai Bell, Samsung, CATT, InterDigital imported from 3GU
R3‑170737 PDU session management procedures LG Electronics Inc. imported from 3GU
R3‑170738 TP on PDU session management procedures LG Electronics Inc. imported from 3GU
R3‑170739 Views on 5G Migration Paths China Telecommunications imported from 3GU
R3‑170740 RAN2 part of Text Proposal to TR 38.912 NTT DOCOMO INC. (Rapporteur) imported from 3GU
R3‑170741 Solutions for TCP issue Qualcomm Incorporated, CMCC imported from 3GU
R3‑170742 TP of solutions and conclusion for TCP issue Qualcomm Incorporated, CMCC imported from 3GU
R3‑170743 Further clarification on UL QoS marking Intel Corporation (UK) Ltd imported from 3GU
R3‑170744 Update of TR 38.801 (v111) on Study on New Radio Access Technology: Radio Access Architecture and Interfaces NTT DOCOMO INC. (Rapporteur) imported from 3GU
R3‑170745 Further clarification on UL QoS marking (pCR) Intel Corporation (UK) Ltd imported from 3GU
R3‑170746 Draft Status Report for NR in RAN3 NR#1 NTT DOCOMO INC. imported from 3GU
R3‑170747 TP for conclusion of video issue Qualcomm Incorporated, Huawei imported from 3GU
R3‑170748 TP for DANE in PGW Qualcomm Incorporated, CMCC imported from 3GU
R3‑170749 SAND support by LTE Qualcomm Incorporated imported from 3GU
R3‑170750 Service Continuity and mobility Ericsson -
R3‑170751 TR 30.531 v1.27.0 Work Plan and Working Procedures - RAN WG3 ETSI MCC -
R3‑170752 Reply LS to LS on QoS for Priority Services Applied Communication Sciences imported from 3GU
R3‑170753 Overload control for CP CIoT EPS optimization NEC, Qualcomm Incorporated -
R3‑170754 LS on IMSI-paging based Restoration and eDRX Nokia -
R3‑170755 Introduction of eDECOR in RAN Ericsson -
R3‑170756 Introduction of eDECOR in RAN Ericsson -
R3‑170757 Introduction of eDECOR in RAN Ericsson -
R3‑170758 Introduction of eDECOR in RAN Ericsson, NEC -
R3‑170759 TR 36.933 v1.3.0 CMCC -
R3‑170760 TP for the solution of video optimization Huawei -
R3‑170761 TP for conclusion of video issue Qualcomm Incorporated, Huawei -
R3‑170762 Introduction of the light connected mode Ericsson -
R3‑170763 Introduction of the light connected mode Ericsson -
R3‑170764 On the CR versions for LC provided to RAN3#95 Ericsson -
R3‑170765 TP of solutions and conclusion for TCP issue Qualcomm Incorporated, Nokia -
R3‑170766 Text Proposal for solutions to address backhaul long latency issue Nokia, Alcatel-Lucent Shanghai Bell, CMCC, Qualcomm Incorporated, NEC, ZTE -
R3‑170767 Introduction of eMOB Stage2 of RAN3 Part ZTE Corporation, Samsung, China Telecom, China Unicom -
R3‑170768 Introduction of eMOB Stage3 ZTE, Samsung, China Telecom, China Unicom, Intel -
R3‑170769 TR 36.742 v0.4.0 Nokia -
R3‑170770 Additional use case and solutions required to complete the study item Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170771 Evaluation criteria proposal Nokia, Alcatel-Lucent Shanghai Bell, Fujitsu -
R3‑170772 Text Proposal for solutions to address backhaul long latency issue Nokia, Alcatel-Lucent Shanghai Bell, CMCC, Qualcomm Incorporated, NEC, ZTE -
R3‑170773 LS (S2-170024/R2-169136) to SA1, SA2, RAN1 and RAN2 on inter-carrier/inter-PLMN RAN WG4, LGE -
R3‑170774 LS on user plane security termination SA3, Nokia -
R3‑170775 LS on IPSec use for non-3GPP access SA3, Broadcom -
R3‑170776 Reply LS on R2-169139 eLWA enhancements SA3, Nokia -
R3‑170777 LS response on security issues in S3-170013/R2-169115 SA3, Nokia -
R3‑170778 On mobility without WT change Qualcomm Incorporated -
R3‑170779 Clarification that the Xw UE ID is unique within relevant node Nokia, Alcatel-Lucent Shanghai Bell, Intel Corporation -
R3‑170780 X2AP Support for Inter-eNB Mobility without WT Change Ericsson, Nokia, Alcatel-Lucent Shanghai Bell, Intel Corporation, Brocade, Qualcomm Incorporated -
R3‑170781 XwAP Support for Inter-eNB Mobility without WT Change Ericsson, Intel Corporation, Qualcomm Incorporated -
R3‑170782 Inter-eNB mobility with LWA active Nokia, Alcatel-Lucent Shanghai Bell, Intel Corporation, LG Electronics -
R3‑170783 Introduction of WLAN band indication Intel Corporation (UK) Ltd -
R3‑170784 Uplink bearer identification Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation -
R3‑170785 Enabling uplink data bearers Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation -
R3‑170786 Enabling uplink data bearers Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation -
R3‑170787 Enabling uplink data bearers Nokia, Alcatel-Lucent Shanghai Bell, Qualcomm Incorporated, Intel Corporation -
R3‑170788 WT Notifying neighbour eNB information on Xw NEC -
R3‑170789 eLWIP: Xs stage-2 proposal for TS 36.300 Intel Corporation, Qualcomm Incorporated -
R3‑170790 Way Forward on Open Issues on eLWIP Nokia -
R3‑170791 Enabling LWIP support over Xw Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170792 Enabling LWIP support over Xw Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170793 LWIP Addition and Modification Ericsson, Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170794 RAN2 part of Text Proposal to TR 38.912 NTT DOCOMO INC. (Rapporteur) -
R3‑170795 FFS and editor’s note on TR38.801 NTT DOCOMO INC. -
R3‑170796 Response To R3-170685 Nokia -
R3‑170797 TP for Capturing eLTE Relevant Agreements ZTE Corporation -
R3‑170798 TP: Corrections to CN/RAN functional split Huawei -
R3‑170799 TP on description correction for path switch procedure Samsung -
R3‑170800 TP for NG Interface Relevant Corrections ZTE Corporation -
R3‑170801 Paging Ericsson -
R3‑170802 LS response on security issues in S3-170485 (R3-170777) Nokia -
R3‑170803 TP on the cons of standardizing low-layer splits Ericsson, Huawei, HiSilicon -
R3‑170804 Further Consideration on Xn Procedures for NR/LTE Tight-Interworking ZTE Corporation -
R3‑170805 Introduction of a new special subframe configuration CATT -
R3‑170806 Introduction of RACH-less and make before break Intel -
R3‑170807 LS Response to LS on SA2 involvement for the light connection RAN2, Intel -
R3‑170808 LS response to CT1 work on LTE Light Connection RAN2, Intel -
R3‑170809 eNB handling in case of RAN paging failure Huawei -
R3‑170810 Introduction of Light Connected State Nokia, Alcatel-Lucent Shanghai Bell, Huawei, China Telecom, China Unicom -
R3‑170811 Introduction of light connection in X2AP Huawei, Nokia, China Telecom, China Unicom, Qualcomm Incorporated, Samsung -
R3‑170812 Introduction of light connection in S1AP Huawei, Nokia, China Telecom, China Unicom, Samsung, Intel, Qualcomm Incorporated -
R3‑170813 Introduction of the light connected mode Ericsson -
R3‑170814 Introduction of the light connected mode Ericsson -
R3‑170815 Introduction of the light connected mode Ericsson -
R3‑170816 Response to R3-170683 Nokia -
R3‑170817 Introduction of eMOB Stage3 ZTE, Samsung, China Telecom, China Unicom, Intel -
R3‑170818 Support of Redirection for VoLTE Huawei -
R3‑170819 Introduction of QMC for streaming services Huawei -
R3‑170820 Introduction of QMC for streaming services Huawei -
R3‑170821 TP for network slice and CN node selection Qualcomm Incorporated -
R3‑170822 TP on Mobility and Mapping of NW slices Ericsson -
R3‑170823 TP on Further Mobility Procedures descriptions for NW slicing Ericsson -
R3‑170824 Proposed way forward on lower layer functional split between CU-DU for NR Deutsche Telekom, Telecom Italia, NTT DoCoMo, Orange, AT&T, Verizon, SK Telecom, KT, China Unicom -
R3‑170825 Introduction of OTDOA enhancements for NB-IOT Huawei -
R3‑170826 Support of RLF with UE Context Retrieval for CP CIoT Optimisation Ericsson -
R3‑170827 Support of RLF with UE Context Retrieval for CP CIoT Optimisation Ericsson -
R3‑170828 Support of RLF with UE Context Retrieval for CP CIoT Optimisation Ericsson -
R3‑170829 [DRAFT] Reply LS on mobility enhancements for eNB-IoT Huawei -
R3‑170830 Introduction of coverage level for location service Huawei -
R3‑170831 Introduction of S1 UE information retrieve procedure Huawei -
R3‑170832 Introduction of S1 UE information retrieve procedure Huawei -
R3‑170833 Introduction of Coverage Enhancement Authorization Huawei, Intel -
R3‑170834 Way forward for IMSI-based paging restoration and eDRX Nokia -
R3‑170835 Introduction of UTDOA enhancements for NB-IOT (CR LPPa) Huawei -
R3‑170836 Introduction of UTDOA enhancements for NB-IOT(CR SLmAP) Huawei -
R3‑170837 eLWIP: Xs stage-2 proposal for TS 36.300 Intel Corporation, Qualcomm Incorporated -
R3‑170838 Chairman’s Notes for Flexible eNB-ID and Cell-ID in E-UTRAN WI Nokia (Session Chairman) -
R3‑170839 Chairman’s Notes for V2X Session Ericsson (Session Chairman) -
R3‑170840 Introduction of new period values for MBMS LG Electronics Inc. -
R3‑170841 LS on the progress of QoE Measurement Collection for Streaming to RAN3, SA4, SA5 and CT1 TSG RAN2, Ericsson -
R3‑170842 Support of V2X over S1 LG Electronics Inc., Huawei, CATT, ZTE -
R3‑170843 Support of V2X over S1 LGE -
R3‑170844 Introduction of New types of eNB ID Huawei, China Telecom -
R3‑170845 Introduction of New types of eNB ID Huawei, China Telecom -
R3‑170846 Introduction of New types of eNB ID Huawei, China Telecom -
R3‑170847 Introduction of New types of eNB ID Huawei, China Telecom -
R3‑170848 Introduction of New types of eNB ID Huawei, China Telecom -
R3‑170849 Reply to the reply LS on Flexible eNB-ID and Cell-ID in E-UTRAN Ericsson -
R3‑170850 Reply to the reply LS on Flexible eNB-ID and Cell-ID in E-UTRAN Ericsson -
R3‑170851 TP: Corrections for QoS Huawei -
R3‑170852 Correction of QoS principles Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170853 TP for Xn Interface Relevant Corrections ZTE Corporation -
R3‑170854 Corrections on Option 3/3a/3x LG Electronics Inc. -
R3‑170855 TP for clean-up of section 10.1.2 Qualcomm Incorporated -
R3‑170856 TP for SCG split bearer as Option 7x Huawei, Deutsche Telekom, Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170857 Indication on UE monitoring IMSI mode 16384 for Paging Huawei -
R3‑170858 Indication on UE monitoring IMSI mode 16384 for Paging Huawei -
R3‑170859 Proposed Way Forward on functional split Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170860 Conclusion of low-layer splits ricsson, Huawei, Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170861 Proposed way forward on higher layer functional split between CU-DU for NR AT&T, Verizon, LGE, Nokia, CATT, Samsung, KT , Fujitsu, China Mobile -
R3‑170862 Proposed Way Forward on functional split Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170863 TP for UP Protocol Stack Updates with LTE-NR Tight-Interworking Option 4/4a/7/7a ZTE Corporation -
R3‑170864 High layer functional split and control-user planes separation Vodafone Group Services Ltd imported from 3GU
R3‑170865 Views on 5G Migration Paths China Telecommunications -
R3‑170866 Way forward on Light connection Huawei -
R3‑170867 TP for New Section of Intra-NR Dual Connectivity ZTE Corporation -
R3‑170868 Proposed way forward on lower layer functional split between CU-DU for NR Deutsche Telekom, Telecom Italia, NTT DoCoMo, Orange, AT&T, Verizon, SK Telecom, KT, China Unicom -
R3‑170869 Proposed way forward on higher layer functional split between CU-DU for NR AT&T, Verizon, Fujitsu, LGE, Nokia, KT, Xilinx, Vodafone -
R3‑170870 Way forward on high Layer split Ericsson -
R3‑170871 WF on low layer split Ericsson -
R3‑170872 TP to the conclusion of the TR Ericsson -
R3‑170873 Proposed way forward on higher layer functional split between CU-DU for NR AT&T, Verizon, Fujitsu, LGE, Nokia, KT, Xilinx, Vodafone -
R3‑170874 Reliable DL NAS delivery based on hop-by-hop acknowledgements Ericsson -
R3‑170875 Text Proposal for Option 4 and 7 on procedures LG Electronics Inc. -
R3‑170876 TP for conclusion on high layer Split Ericsson -
R3‑170877 Indication on UE monitoring IMSI mode 16384 for Paging Huawei -
R3‑170878 Indication on UE monitoring IMSI mode 16384 for Paging Huawei -
R3‑170879 LS on IMSI-paging based Restoration and eDRX Nokia -
R3‑170880 [DRAFT] Reply LS on mobility enhancements for eNB-IoT Huawei -
R3‑170881 Reply LS on mobility enhancements for eNB-IoT Huawei -
R3‑170882 Introduction of OTDOA enhancements for NB-IOT Huawei -
R3‑170883 Introduction of coverage level for location service Huawei -
R3‑170884 Introduction of QMC for streaming services Huawei -
R3‑170885 Introduction of QMC for streaming services Huawei -
R3‑170886 LS on DCN-ID Range CT4, Ericsson -
R3‑170887 Introduction of Coverage Enhancement Authorization Huawei, Intel -
R3‑170888 Way forward on Light connection Huawei -
R3‑170889 TP of solutions and conclusion for TCP issue Qualcomm Incorporated, Nokia -
R3‑170890 Introduction of eDECOR in RAN Ericsson -
R3‑170891 Introduction of eDECOR in RAN Ericsson -
R3‑170892 Introduction of eDECOR in RAN Ericsson -
R3‑170893 Introduction of eDECOR in RAN Ericsson, NEC -
R3‑170894 TR 36.742 v0.5.0 Nokia -
R3‑170895 LS response on security issues in S3-170485 (R3-170777) Nokia -
R3‑170896 LS response on security issues in S3-170485 (R3-170777) Nokia -
R3‑170897 LS on IMSI-paging based Restoration and eDRX Nokia -
R3‑170898 RAN2 part of Text Proposal to TR 38.912 NTT DOCOMO INC. (Rapporteur) -
R3‑170899 TP on Further Mobility Procedures descriptions for NW slicing Ericsson -
R3‑170900 Text Proposal for Option 4 and 7 on procedures LG Electronics Inc. -
R3‑170901 TP for New Section of Intra-NR Dual Connectivity ZTE Corporation -
R3‑170902 Proposed Way Forward on functional split Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170903 eLWIP: Xs stage-2 proposal for TS 36.300 Intel Corporation, Qualcomm Incorporated -
R3‑170904 LWIP Addition and Modification Ericsson, Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170905 Enabling LWIP support over Xw Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170906 High layer functional split and control-user planes separation Vodafone Group Services Ltd -
R3‑170907 Enabling LWIP support over Xw Nokia, Alcatel-Lucent Shanghai Bell -
R3‑170908 LS on IMSI-paging based Restoration and eDRX Nokia -
R3‑170909 Introduction of S1 UE information retrieve procedure Huawei -
R3‑170910 Introduction of S1 UE information retrieve procedure Huawei -
R3‑170911 Introduction of eMOB Stage3 ZTE, Samsung, China Telecom, China Unicom, Intel -
R3‑170912 Introduction of S1 UE information retrieve procedure Huawei -
R3‑170913 Introduction of QMC for streaming services Huawei -
R3‑170914 Introduction of QMC for streaming services Huawei -
R3‑170915 Introduction of QMC for streaming services Huawei -

page generated from database: 2019-11-04 12:31:40