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[RAN2#116bis-e]
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R2-22xxxxx_SDT_OpenIssueList_v00_rapp.docx
2022/01/27 10:27
53,2 KB
updated_R1-2112976 Consolidated higher layers parameter list for Rel-17 NR_SDT.xlsx
2022/01/27 10:27
264,8 KB
R2-22xxxxx_draft-RunningSdtCr_38331-g41_PostR2#116bis-e_v00_rapp.docx
2022/01/27 10:27
2263,5 KB
R2-22xxxxx_SDT_OpenIssueList_v01_Xiaomi.docx
2022/01/28 3:31
53,1 KB
R2-22xxxxx_SDT_OpenIssueList_v02_Intel.docx
2022/01/28 6:19
57,8 KB
R2-22xxxxx_SDT_OpenIssueList_v03_Ericsson.docx
2022/01/28 7:39
59,4 KB
R2-22xxxxx_SDT_OpenIssueList_v04_NEC.docx
2022/01/28 8:12
58,1 KB
R2-22xxxxx_SDT_OpenIssueList_v05_Qualcomm.docx
2022/01/28 8:37
60,8 KB
R2-22xxxxx_SDT_OpenIssueList_v06_Huawei.docx
2022/01/28 11:32
58,9 KB
R2-22xxxxx_SDT_OpenIssueList_v07_NEC.docx
2022/01/28 11:56
59,6 KB
R2-22xxxxx_SDT_OpenIssueList_v08_rapp(final).docx
2022/01/28 12:07
68,6 KB
phase-2
2022/02/09 9:18
12 items.