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draft-R4-2105692_Summary_222_1st_round_v0.docx
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2021/04/14 11:22
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358,3 KB
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draft-R4-2105692_Summary_222_1st_round_v1.docx
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2021/04/14 13:17
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368,9 KB
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Summary_222_1st_round_v00.docx
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2021/04/12 5:36
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217,8 KB
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Summary_222_1st_round_v01_MTK.docx
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2021/04/12 12:57
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222,9 KB
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Summary_222_1st_round_v02_MTK_Ericsson.docx
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2021/04/12 18:20
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231 KB
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Summary_222_1st_round_v03_Ericsson_Apple.docx
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2021/04/13 0:36
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233,5 KB
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Summary_222_1st_round_v04_Apple_CMCC.docx
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2021/04/13 8:00
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236,1 KB
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Summary_222_1st_round_v05_CMCC_QC.docx
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2021/04/13 8:49
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238,8 KB
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Summary_222_1st_round_v06_QC_ZTE.docx
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2021/04/13 9:25
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232 KB
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Summary_222_1st_round_v07_ZTE_Xiaomi.docx
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2021/04/13 12:00
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213,2 KB
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Summary_222_1st_round_v08_Xiaomi_Ericcson.docx
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2021/04/13 13:22
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221,7 KB
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Summary_222_1st_round_v09_Ericcson_Samsung.docx
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2021/04/13 13:53
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221,7 KB
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Summary_222_1st_round_v10_Samsung_NOK.docx
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2021/04/13 15:21
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228,3 KB
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Summary_222_1st_round_v11_NOK_Intel.docx
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2021/04/13 15:41
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228,2 KB
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Summary_222_1st_round_v12_Intel_Thales.docx
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2021/04/13 22:36
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341,4 KB
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Summary_222_1st_round_v13_Thales_LGE.docx
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2021/04/14 0:51
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342,3 KB
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Summary_222_1st_round_v14_LGE_NEC.docx
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2021/04/14 6:49
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343,8 KB
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Summary_222_1st_round_v15_NEC_HW.docx
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2021/04/14 7:15
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346,5 KB
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Summary_222_1st_round_v16_HW_CATT.docx
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2021/04/14 7:54
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388,1 KB
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