|
draft-R4-2105692_Summary_222_1st_round_v0.docx
|
2021/04/14 11:22
|
358,3 KB
|
|
draft-R4-2105692_Summary_222_1st_round_v1.docx
|
2021/04/14 13:17
|
368,9 KB
|
|
Summary_222_1st_round_v00.docx
|
2021/04/12 5:36
|
217,8 KB
|
|
Summary_222_1st_round_v01_MTK.docx
|
2021/04/12 12:57
|
222,9 KB
|
|
Summary_222_1st_round_v02_MTK_Ericsson.docx
|
2021/04/12 18:20
|
231 KB
|
|
Summary_222_1st_round_v03_Ericsson_Apple.docx
|
2021/04/13 0:36
|
233,5 KB
|
|
Summary_222_1st_round_v04_Apple_CMCC.docx
|
2021/04/13 8:00
|
236,1 KB
|
|
Summary_222_1st_round_v05_CMCC_QC.docx
|
2021/04/13 8:49
|
238,8 KB
|
|
Summary_222_1st_round_v06_QC_ZTE.docx
|
2021/04/13 9:25
|
232 KB
|
|
Summary_222_1st_round_v07_ZTE_Xiaomi.docx
|
2021/04/13 12:00
|
213,2 KB
|
|
Summary_222_1st_round_v08_Xiaomi_Ericcson.docx
|
2021/04/13 13:22
|
221,7 KB
|
|
Summary_222_1st_round_v09_Ericcson_Samsung.docx
|
2021/04/13 13:53
|
221,7 KB
|
|
Summary_222_1st_round_v10_Samsung_NOK.docx
|
2021/04/13 15:21
|
228,3 KB
|
|
Summary_222_1st_round_v11_NOK_Intel.docx
|
2021/04/13 15:41
|
228,2 KB
|
|
Summary_222_1st_round_v12_Intel_Thales.docx
|
2021/04/13 22:36
|
341,4 KB
|
|
Summary_222_1st_round_v13_Thales_LGE.docx
|
2021/04/14 0:51
|
342,3 KB
|
|
Summary_222_1st_round_v14_LGE_NEC.docx
|
2021/04/14 6:49
|
343,8 KB
|
|
Summary_222_1st_round_v15_NEC_HW.docx
|
2021/04/14 7:15
|
346,5 KB
|
|
Summary_222_1st_round_v16_HW_CATT.docx
|
2021/04/14 7:54
|
388,1 KB
|