3GPP Spec = 25.222 - CT3 aspects CS-IBCF
This page lists the 3GPP Work Items which are or might in future be associated with or have an effect upon the above Technical Specification or Technical Report. Click on the WI unique ID number to go to its entry on the Gantt chart page.
| Unique ID | Code | Title | Release |
| - | CT3 aspects CS-IBCF | Rel-8 | |
| Mp | Mp (MRFC - MRFP) interface | Rel-7 | |
| VHCRTDD-Phys | VHCRTDD: Physical Layer | Rel-7 | |
| RANimp | Rel-7 RAN improvements | Rel-7 | |
| RANimp-VHCRTDD-EDCH | 7.68 Mcps TDD Enhanced Uplink | Rel-7 | |
| EDCHTDD-Phys | 3.84 Mcps TDD Enhanced Uplink: Physical Layer | Rel-7 | |
| MBMSE | MBMS Enhancements | Rel-7 | |
| MBMSE-RANPhysTDD | MBMS TDD Physical layer Enhancements | Rel-7 | |
| - | MBMS TDD Physical layer Enhancements | Rel-7 | |
| MBMSE-RANPhysLCRTDD | MBMS Low Chip Rate TDD Physical Layer Enhancement | Rel-7 | |
| LCRTDD-EDCH | 1.28 Mcps TDD Enhanced Uplink | Rel-7 | |
| LCRTDD-EDCH-Phys | 1.28 Mcps TDD Enhanced Uplink: Physical Layer | Rel-7 | |
| MBSFN-DOB | MBSFN Downlink Optimised Broadcast 3.84 Mcps TDD | Rel-8 | |
| RANimp | Rel-8 RAN improvements | Rel-8 | |
| RANimp-64Qam1.28TDD | 64QAM for 1.28 Mcps TDD HSDPA | Rel-8 | |
| EDCH | FDD Enhanced Uplink | Rel-6 | |
| EDCH-Phys | FDD Enhanced Uplink - Physical Layer | Rel-6 | |
| RANimp | Rel-6 RAN improvements | Rel-6 | |
| MBMS | Multimedia Broadcast and Multicast Service | Rel-6 | |
| - | Security Aspects of MBMS | Rel-6 | |
| CH | Charging Management | Rel-6 | |
| RANimp | Rel-5 RAN improvements | Rel-5 | |
| LCRTDD | Low Chip Rate TDD option | Rel-4 | |
| RANimp | Rel-4 RAN improvements | Rel-8 |
page generated from database: 2008-07-02 14:59:50