Specification #: 23.700-05
Reference: 23.700-05
Title: Study on architecture enhancements for vehicle-mounted relays
Status: Under change control
Type: Technical report (TR)
Initial planned Release: Release 18
Internal:
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Remarks (0)
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History
Action dateActionAuthor
2022-01-14 06:22 UTC
Specification has been created for release Rel-18
Maurice Pope
2022-12-20 07:20 UTC
Specification has been made Under Change Control
Maurice Pope
Primary responsible group: SA 2
Secondary responsible groups: -
Rapporteurs
NameCompany
Hong Cheng
Qualcomm Incorporated
25668
Parent Specifications
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Related Work Items
UIDAcronymTitleResp. grp(s) 
940057
FS_VMR
Study on Architecture Enhancements for Vehicle Mounted Relays
S2
See details True
  • MeetingsVersionUpload dateComment 
    2022-12-21
    MCC editorial Update for publ...
    60465SA#98-e79993
    2022-11-29
    SP-221115: MCC editorial upda...
    60465SA#98-e79702
    2022-11-24
    Updated with P-CRs approved a...
    60059SA2#15479633
    2022-10-21
    Updated with P-CRs approved a...
    60310SA2#153-e79516
    2022-09-01
    SP-220817: MCC editorial upda...
    60337SA#97-e78802
    2022-08-30
    Updated with P-CRs approved a...
    60309SA2#152-e78791
    2022-05-25
    Updated with P-CRs approved a...
    60308SA2#151-e77880
    2022-04-16
    Updated with P-CRs approved a...
    60307SA2#150-e77697
    2022-03-02
    Updated with P-CRs approved a...
    60225SA2#149-e75808
    2022-03-02
    S2-2201574: Original Skeleton
    60095SA2#148-e75627